Adhesives, Glue

La seringue de pâte thermique HY510 est idéale pour les utilisateurs de PC cherchant à réduire la température de fonctionnement de leur processeur. Avec sa formule haute conductivité thermique et sa quantité de 30g, cette pâte thermique permet une transmission de chaleur optimale entre le processeur et le dissipateur thermique, ce qui réduit les risques de surchauffe. Non conductrice et facile à appliquer, la pâte thermique HY510 est un choix abordable et efficace pour améliorer les performances de votre PC. Commandez dès maintenant pour prolonger la durée de vie de votre processeur.

Product Description:
Product Type: Solder Paste
Product Name: Lead and Halogen Free Solder Paste Plux RELIFE HW11

Elevate your soldering projects to new heights with the environmentally conscious and precision-engineered Lead and Halogen Free Solder Paste Plux RELIFE HW11. Engineered for professionals and hobbyists alike, this premium solder paste ensures top-tier performance while keeping environmental impact in check.
Key Benefits:

Eco-Friendly Composition: Crafted with a commitment to sustainability, RELIFE HW11 contains no lead or halogen, ensuring a safer work environment without compromising on quality.
Superior Performance: Boasting excellent wetting properties and optimal thermal stability, this solder paste provides unparalleled reliability for a wide range of electronic applications.
Consistent Results: With its uniform particle size and consistent viscosity, experience smoother application and unbeatable soldering precision.

Technical Specifications:

Composition: Lead-free, halogen-free
Viscosity: Perfectly balanced for smooth application
Melting Point: Designed for efficient soldering operations
Storage Temperature: 0-10°C for optimal shelf life
Shelf Life: 12 months from the date of purchase

Compatibility:
The RELIFE HW11 is compatible with a comprehensive range of substrates and components, making it the ideal choice for smartphones, laptops, wearables, and other consumer electronics. Its versatile formulation ensures seamless integration with various PCB types and surface finishes.

Key Features of the Manual Glue Gun/5-10CC - RELIFE RL-062A Pro
The RELIFE RL-062A Pro Manual Glue Gun is designed to meet the high standards required for professional applications. Its robust performance and user-friendly features make it an essential tool for precision gluing tasks across various industries.


Capacity and Versatility: Accommodating 5-10CC glue, this model supports a range of adhesive types including epoxy, silicone, and more. Its flexible capacity ensures suitability for tasks of varying scales.


Precision Control: The RL-062A Pro offers enhanced control with a smooth, manual trigger mechanism, allowing for precise application. This precision ensures reduced wastage and optimal results on every use.


Ergonomic Design: Engineered with user comfort in mind, the RL-062A Pro features an ergonomic handle that minimizes hand fatigue, making it ideal for extended use in demanding work environments.


Durable Construction: Constructed from high-quality materials, this glue gun ensures long-lasting performance and reliability, capable of withstanding rigorous industrial use.


Easy Loading and Maintenance: The straightforward loading system is designed for quick and hassle-free glue cartridge changes, minimizing downtime. Its simple maintenance requirements further enhance operational efficiency.


Safety Features: Equipped with an integrated stand and non-drip nozzle, it prioritizes safety and cleanliness in the workspace, ensuring a clean, professional finish every time.


Versatile Applications: Perfect for use in electronics, crafts, and industrial repairs, this glue gun adapts effortlessly to a wide array of applications, proving to be an invaluable asset for B2B customers seeking reliable and versatile gluing solutions.


The RELIFE RL-062A Pro stands out as a top choice for professionals demanding excellence, precision, and ease of use in their adhesive tasks.

Key Features of RELIFE HW32S Lead and Tin Free Solder Paste


Eco-Friendly Composition: The RELIFE HW32S Solder Paste is formulated without lead and tin, making it an environmentally responsible choice. It aligns with RoHS standards, ensuring safety and sustainability for both users and the environment.


Innovative Alloys: This solder paste utilizes advanced, alternative alloys that offer excellent solderability and reliable performance, catering to modern electronics assembly requirements without compromising on quality.


Precision Application: Engineered for accuracy, the paste is designed to provide consistent deposit sizes, reducing waste and ensuring optimal connections. It is suitable for intricate PCB designs and components with fine pitches.


Superior Flux Technology: Featuring cutting-edge flux technology, RELIFE HW32S enhances wetting and reduces voids, ensuring strong, reliable joints. This results in improved electrical conductivity and long-term durability of soldered connections.


Temperature Versatility: With a broad working temperature range, this solder paste is perfect for various applications, from consumer electronics to industrial devices. It performs robustly under both low and high-temperature soldering processes.


Reduced Residues: Post-solder residues are minimal and non-corrosive, simplifying cleanup and enhancing both the aesthetic and functional aspects of the finished product.


User-Friendly Packaging: Available in convenient, easy-to-store packaging that prolongs shelf life and maintains paste quality, making it ideal for both small-scale operations and large manufacturing environments.


Consistent Performance: Ensures repeatable outcomes and high production yields, making it an essential component for manufacturers seeking reliability in high-volume production runs.

Key Features of Solder Paste Containing Lead and Silver RELIFE HW21:


High-Quality Composition: RELIFE HW21 solder paste features a premium composition containing lead and silver, ensuring excellent thermal and electrical conductivity for various soldering applications.


Optimal Melting Point: The inclusion of silver in the formula provides an optimal melting point, facilitating efficient and reliable soldering even under demanding conditions, making it ideal for precision electronics work.


Superior Wetting Properties: This solder paste offers superior wetting properties, ensuring a consistent and reliable connection between components, which is essential for high-performance electronic assemblies.


Enhanced Alloy Strength: The combination of lead and silver enhances the mechanical strength of the solder joints, providing robustness and durability, especially in applications subjected to thermal cycling and mechanical stress.


Consistent Viscosity and Spread: RELIFE HW21 is designed for consistent viscosity, allowing for smooth application and even spread over surfaces, reducing the occurrence of defects and rework during the assembly process.


Excellent Flux Activity: The solder paste includes an active flux system that efficiently removes oxides from the surfaces, ensuring clean and robust solder joints with minimal residue.


Application Versatility: Suitable for various soldering techniques, including reflow soldering and manual soldering, making it versatile for both industrial manufacturing and DIY electronics projects.


Reliable Performance: Renowned for its reliability, the RELIFE HW21 solder paste ensures high-performance results in various electronic soldering applications, from consumer electronics to industrial equipment.


User-Friendly Packaging: Available in convenient packaging options to meet different user requirements, ensuring ease of use and storage for both small-scale and large-scale applications.

Key Features of RELIFE HW21S Solder Paste Containing Lead and Silver:


High-Quality Composition: RELIFE HW21S is formulated with a premium blend of lead and silver, ensuring exceptional solder joint reliability and excellent thermal conductivity for demanding electronic applications.


Optimal Melting Point: Designed for efficient soldering tasks, this paste offers a controlled melting range, enhancing precision in reflow and manual soldering processes, which is crucial for intricate PCB work.


Superior Wettability: Experience excellent wettability on a variety of substrates, facilitating smooth and consistent flow to create robust, corrosion-resistant solder joints.


Fine Particle Size: The consistent and fine particle distribution allows for precise application, even in the most detailed electronic assemblies, contributing to high-quality finish and performance.


Long Stencil Life: Offers extended stencil life with stable viscosity over time, which supports production efficiency by reducing the number of stencil cleanings required.


Enhanced Adhesion: Superior adhesion properties offer strong bonding of components to the circuit board, which helps in minimizing movement during high-temperature soldering operations.


Lead and Silver Benefits: Incorporating lead provides ease of use with lower melting temperatures, while silver adds strength to the connections and improves electrical conductivity, effectively supporting high-frequency applications.


Versatile Usage: Ideal for both automated and manual soldering, this solder paste is suitable for a wide range of electronic components and surface mount devices, catering to diverse industry needs.


RoHS Compliance: While containing lead, this paste offers RoHS-compliant options for specific applications requiring lead-based solders, supporting environmental and safety standards